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39 4! 28 el e1l g Etrj^l el EE 8! 1tr al ==all gel 7Hg 1.+ d ,I* 9+6Ir "l ,rilt dzlEltrE +C€ €zl z]|9 d(chip)Ee ol7g4 9l= +ll "lul(wafer)-4*e1 +C € Hls.^1 lz}(semiconductor package)E "Js= Ct*4 g Hls;1 =Bolel-l. +4. Hls.z1+ el+.il^l zlqlzl= aaol 44 4.zl7 dra124 =? or L ztz =l 4 El-tr-(IC : Integrated Circuit)=g "l zl t H!=.;1 zfl tr _ Eal "J=q ,<l .4 ^ L ' --1 O t zl qlEql 'HlEiil d4El-tr'uI 'HlEiil' +g '44qs'7+= *gzI g+gr gl+. [:zH 2-1]g 7l* 'J 7l r]89 t 9l= B (op : Dual Inline Packaee) H]s,1e1 + =o14. rB ql^l e+ eol 57+^9 014 ^rl4E s-tr-r{l 5B (motding)€ R}E.;1 rz}E e ilg $=.rol4 4EE +=+ Hl]g Eql ,lol7l glg + a _ =94"J +ae+ ?14 = = ^lo)71 St+. Hls.;1 lzlts Hls.:1 d+ 4=gql"J(L/F : Leadframe), r4r HI=;1 ar+ EdsE BBg.ll+ 4=uztl"J *E(olE fHol4l .J)g _ H-o.alzl fl6}q 54.qr+ Ag EeE,^l gB+ vlzlzl BEo-e +Cqq il+.58€ + +q .I+= Hls.;1 ar+ 4=s7I"J ^Iolel 4214 dE= il 4617l g6}q "il* zl EB zJ yl+g EB clol9 4ol(d ) u}"l zlzl rI 4 = gill"J :.aJ 2-1 =J HJ-Eill trH7l^lol T=
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제 2 장 리드프레임 표면처리
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제1절 리드프레임의 개요
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1. 구생
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제1절 리드프레임의 개요
46page

1. 구생
46page

1. 구생