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^113= Elt|sl-?7luJo; ^llIg 13 al-. 4 = oH trl EIEHJ aE ulld$or 4+"r gE^r ser +4)7r +4Ar g-r., s.Edtlqr ga}] Eg 1+g E#oI e-1+ dE€ +q= gal Hlolg(via hole)ol gee e€Elz} rl6Jq -7 9l+. olql rr+4 q ^tr] E El(aspect ratio)z} =-Al 9:z dzls?9 t"J d=rC ol 4uulzl= E4l7I EC€+. +d6tl +?_lE;|E t"J+ al=ol 6ealz1 ulE."I ^ .1 E- E 4 E _ l E _ B q glq ^l = yII-JEAB sE 611, ril'J 4zl 7zl s.#g rlltld}q E.gE +ddl +4E#g "J6l= *Bolu}. +g q^EEHIE ^+g. Etld$ zla,rl *ol 617il t"J+ EE 9"-l"l 9"lzlts +++ *8"14. o [. trl{ EJ 0]| trlElEtI vli'J ol q EIEB + Hli6}q .<-l Er Eq qEB ql r]16l EIEJ EEB _qE. vtlEJ 4.zl + ?-lEag ql4l6lr =gE +d6l +4E#g "J6I= *Bol+. Eg-+"ll+-+Z+ +d6ll *:EE-E# zlzl :-=.-=gE(full build) +ddll +4E#-qla zlzl :- = s=- -zI zl /- E E.4 + qla q 9 aX sls= B C ++. 3. g =g(Build up)E ++ EId+9 4laBlB-os +4 1,ll E= ++,19 *H 4+ElgS ^Iol ql E4 E zll:25 ts;. 4 + 5r zI ^ -s 7Ig 7I"J6'L= ,JB g E]] iI 6Iq 4 Bg *B ol r*. _ zoJ E 4+ EI d+E al=rl4l r+r}4 EIE= +c 6Iq +,tl6}q €oI 7l= sLC (surface laminate circuit)*Bol zllB9fl+. +, +4 4+SE qla zllzl -,-=-= ^I +6Iq sls= € ^d + +, +El+C ql+^l izl E= E4 olol = f xlE =B all E+E g.Eol uil 4 (photo imaging)41 9 atl 0.1mmA EE .f.EHlo|(photo via)E 94 + = pl,Blt +Bg f^l=ql u.!=tr}. +d6ll +qEfiql gall ,ill+E ElEe+ +Bg Ed}q d +.J+. E.tr oil ? (photo etching)4l I sll AIZ+E sltr.= zlC 6Ir ulrl z] +C fzlE =Balr s.EElo}= "J$_z +d6ll +4E;t,4-E €Cg HI+61=,,J H gs pJ.rl t El o}S(via hole)E d *rl 7l= r,JE ++ ul dsol "JEq Tl+. [:zB 1-7]g 401 ^ts€B+ B440lqB, E;I +=fl e4lBg']4.ilHtr]. 4. Pl^H-ol=zlEJel Ctrldal ^+E E= "JE trl+ H]ld+E rlElcg ^+g Ea9 alEl^d4 Fg6I+r + + 9lg aE -tr- r1l* 6941q. E#oI .q+9= =^d +ql^l =q +,q+.J+g E;+4q t
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3. 빌드업법
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4. 인쇄회로기판의 신뢰성과 스루홀도금
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3. 빌드업법
20page

4. 인쇄회로기판의 신뢰성과 스루홀도금
20page

3. 빌드업법
20page

4. 인쇄회로기판의 신뢰성과 스루홀도금