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€ 4 = *47)+ "J +, zl=Hls;il *qr, r[ ilEHI d+g EeTl+, 4 da+_EEil 4, <E -r. E -d> 4+4, ol € 4 rJ q, Fg =+^I, zooo S€ "J, ol € zl *x], BF=SrI, 1995 ++Hl xl r-l z-a{ Hl ^(+), ZOCn g q q, € 8* *2], FE ^I, 1983 pcg utld+E zl=$-p, hffifrtJffi, .u AEqEz.ll-J(+), 1995 Tin and Solder plating in the semiconductor industry, A.C.Tani Chapman & Hall; 1992 Tin and tin-alloy plating, J.W.Price; 1990 ASM Handbook, Vol., 5 "surface Engineering" Catherine M. Cotell., et. ali ASM Interna- tional; 1994 o o a a a o a a