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156 Pl=;11 EPI-lq 3ol 6l1tr -e _ o oj 6H ,,\l = Wire Bonding Chiptg Bonding Pade} LZFE lnner lead tipg #^il d (+ 9 oJFplts^id)gg d* rl 4+= r+e. Thermo com- pression Bonding(9oJ4 gonding), Thermosonic Bonding(z'] gg$+ Bonding), Ultrasonic Bonding(t94 gonding)F 9 olB ol 9lt ^tldE *z)Y 25rn-50pneE. Capill- ary(Au ball Bonding), Wedge(Al Wedge Bonding) FE Tool9 ^I-&+trI. Yield t=.;1 ztl=*Z8q glq^.lE *+Eg "J6Iq, F"J€ wafer fol Elld}q +C'J+ wafer f9 Hlgg +EI.ll= +A+9"+ I wafer B chip i41 tllall wafer testE EaI Bol, 9l= "J++9 Hlgg +4.Xts chip fS Eol 9l +. 'JHl4 o -a +gg "Jg 4ts chip +gg "J6.I= A *zl, v*4. ZIP Zigzag In-line Package