147page

140 u=r1 Eol^1il =iGl 6lls _ Q _ o q ld - . 6[| HIEB (rwist) +E gFE"} +EE"J EE "J+ O E^] ZI^}4€ "J 4 f qlE :z I 7^l ol 4E r 7^J "l "J== tJ Etlql fl L=) = '4. +F4l (Board thickness) EA=E +rl= ,lel.J EiI+g E++ #+"J6J €g 7l+ E= EilE Elld+el +4). d^I ++al (Total board thickness) #+"J.J €trzl+ E= EAE EId+E +Ee +q drl +41. gil*+ zd'Js. (Registration) zlAg glzlql 4+ rilEJE 9l^lq*ts 4E. +€ql^]E 714 (Edge distance) sAE HId+E fl!+Eql^] uIEJ IE= A*rtlzl9 z)4. EiI * (Conductor width) EaE E1]d+E HIE 9lql^l HI4 _H_gtE "il9 s;I *. EiI ,J4 (Conductor spacing) uaE Etld+€. Hls glql^.] HI+ Hgtg "I, E"J+ql 1l= s;1E4 :z4ql r]]6}alY s;tl €:+E 7)4. "19 ?J4 (Land spacing) 'Jd+ {EeE EiI ,J4. Eiil +41 (Conductor thickness) Bzi€ q+ #+g EEI-J EilE +41. olfrEa (Outgrowth) zl=* gE E= zlxl^-=91 el6}q ?9zl= EiI+Hl = ar+6}g EEq ctlql II|4 ca Eil 4ul9 e+ I rlrl E*. tr] X, (Undercut) qlaq E6Iq E;I ']lEJ gH.I Czl= ++E + E= o -E-6L .!--1 d. gq "J (overhang) olfrE-ie+ trlaE EL. _ H-olE (Void) qlgol .J E.eol +a4 oe Aqgq 9l= *8. =H 74 (Corner crack) EEs -?q+Eql^.lE EEs EA#+E rg. ulzl = .fl (Banel crack) EEE ,Iq+ql^] EFg E?#+E tg. H rJ zlE (Peel strength) €€zl$ql.r'l E;l$ \zlz) 96I"1 g.q+ E+l +Hl'J- e. dgfl olP zorE (Pull-off strength) €€zl+ql^.] {E= ulEr1l g.q+ irflE H11dgql + zl EJ6.J9 E. +ZI qI4 (Delamination) €€zl$ E= ++ EflE Hlld+E r.I+ql^] Czl= +rJE +4. +=T (Blister) €€zl*9 *zJ E= €€zl*yt Eil"-l eql ^821ts ++4ql +Egol+ HAA.