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138 UJE^ll Eol^.lal 8cl 6lltr q o O /\{ = 6H qla zlzl:-.= (Etching resist) UXEJ$ qlaql eltlq €C6Izl flatl 6I=.ll qlaCq vlE. s-=e) urle -+ r __ : - r __ - (Screen printing) t-4^s "J7 EE "]]il= .EJld ^=Ag Fr+^lA^] rluJj.tstlql qIEJE d^I6}= ElB. +e fusing) E;luNej4'E #+ q+€. €-srl7J +, 4*l ^)7)= 7). * qlq ztlgts (Hot air levelling) g+ql el6}q qEE tshlg 41716}r, E.EE €+6I Al 6.1= HlB. +q 7I g A (Solder leveling) +E+ gr+ 7lAl4 6JE +q^l UAE E1]d+ql -t-+ + tsts ('JB+ tstsE =cql= +algJ.+)E zIE-s- "t +E-4 ,t)7) Ets z qL aQlzlE 6'I= a. B €rl ts (Dip soldering) ++g ++.J Eil_E Hlld+g ++ tsB=q zdzl_sE ttql d+rl?ge-Nl, t-=qq gl= E;I rIEJr+ ++ *zlzl d4ol qE+ Bts6I= ,JB. eJ olq €r] eJ (Wave soldering) #?S,ol _6E5r, 3r f,+6}a gl= tsBel g.Eql yA = uld+g d+^14 Bts6I= ,JB. TltL tsts (Vaper phase soldering) +7)71 ++-J qql *=6I= qlLl-zlql E6Lq tsBg 5ol= 45E Bts6I= *8. 4 5e €rJ eJ (Reflow soldering) Elr-l "Jd tstsg *srl z) g EN) Bts6I= ,JH. EE d+ (Surface mounting) ++ +H€- ^I€-6lzl gl, s.;l vIEJq S.Eql^] 4z) 4 d+9 aIts PE RzI ,JB. gts 49 (wettlne) a+ _ EE +ql tstsol t"J6Ir, E+ #qzlzl g*l o|] rzrj Zl ul zl 9l= tlE]]. tsB 94 (Dewetting) +e tsBol #+EEg yl++ +, tstsol ++€ tlEI -a qq tsBE ele +E+ +4s PEol B+4dlzl Ca +EI. eB 4E E=+ (Non wetting) e+EEql= tstsol ++gq 9lzl"J tsBol _EEdil ql= ++gq qlzl e+e tI4. =fl.]c 7l = (Clinched lead) ++E 44zl s+"I AtEqq €r]ts oldql *Eol €q4 ulz}ts 49 ,J^l;L= E+g i;17\ 9la[ €C€ tL4. E= $rl ag- (Cold solder joint) E+E.J 7Ig P €r]ts dE E+++ /]1401+ +q el gg F9E €u] S.EE wetting *rtlz} t"J6};<l *6Iq soldering * zl*ol gC6I= Bts a-J.