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PJ=xll EP_1^1il Aq 6||tr L37 cl -e. o /\{ = 6l| zlzl. _ = _ (Resist) ,I= "f ^l6J+4 +, qleo_q, s;I-"_4, €r-l 5:ql Ell6.Iq 5e Bqg -!tE6l7l fla}q ^l+BI= 9g4e. qla @tching) E;I EIEJ$ u.lEzl 9la}q €€zl+tlE Eilel E€.q_ +Eg +qL4 E= 4714+4e-tr- z{Aal= z). g.E qla @hoto etching) #+"J6J €€zl++ql A+^J ztlzlleg €xl6}r ^I .l4e +Bql E6Iq g,qal ++g qla6}= a. q El ql€ qla (Differential etching) Erl+ +, Eg.qsJ E^I+= g,q+ EiI+E+ SZI Ercsr^l 9.qal g-;I yIEJ"Jg BE+ 6I= qla. qlrl 4 r] @tch factor) Eil +41 HJ.JE ql a 4| ol e]. uJ ul *6"1E ql a 4 ol E ul. LlloJ -dlE (Nail heading) ++ sfl= uId+g E€g_ +Bg #Hg q, +B+ Eql czJ= ql+EiIE 5E Eld. ql^l uI (ptctr back) Ltl?EilE r==EH4g +71^1717) q6}q gqEE €€=1:Elq= _E+++)g ++4 *BsE "Je zf, olttlzl *4 A)71 aI= a. +^l uI (Pustr back) zil+-} 'Ja 7I*6I= 4+, vJa€ 49 4rl flNlrtle 'Jq 984 = 7l* ,JB. l"lo.l zllzl (Desmearing) Drillingrl "I+qql 9al] ++€ fzl E= *:elzlE €.q se+El El+4 HIB ql 9;l] zl zali il 4. (F+ +qlil z1e aJrI.) EFg (Through-hole plating) E.5 d+E 6I7i 9l6}q S eEql A+g EE6I= ,). tI'J EA (Panel plating) 'I.-J diilsQ (+5+Bg s+;J+)ql r}]t se. YtleJ gE (Pattem plating) E;I yIEJ+$.il rfl+ d44 EE. EJlts B (Tenting) E# E5g4 r +trg EiI 'lEJg TlzllEtr- Hq qla 6I= EIB gtsl Ei (Over plate) olul €C€ r.1 tllEJ E= r "J+E +ql + EA. €uJ zllzl :-._=_ (Solder resist) iEflE Hlld$ +E .4 "dqql 6L= .flgC ul$zlltr tr Bts zlfirl ol$Eol tsBol pzl$E$ ali zlzl Ir _ E. -E.-tr- zll z) 2.9 (Photo resist) qq 4^l= +e *E"l Bt}"lql E* s= zl*gE- I ts zI zl :-. e-. Ee zll z) t--E (Plating resist) Eeol g.q!t= +Eql ^I+6I= zf zlle.