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136 LtE^ll E Pl ^1 al E01 6ll tr ol -e _ o /\{ 6ll ztl=* flS (Original production master) ^il=+ gEg "JE=EI ^I+6I= ullg r:r9 El]EJoI 9l = g+. zl=8 €E (Productor master) AE EId+g 4lz617) 9l6}q ^I-*6I= Ellg l:19 utlEJol 9l= gE E= a€. SB (Panel) zl=*49 zlells 5r+6I= rTll oltlel silE HId+ ql 7I*q= zla€Hlql *ts zz1e1 +. Va ry - scoring) y1]tsol+ EAE EIdSg B+6Iz1 9l6}q €;lfl v€ el +. .rl H E enEl H H |--ll-H (Subtractive process) #+"JH €€zl+tlE Eilqql EB,e_ +EE =8, qla Eql 9aI d44se_ 417]6}q, EiIrllEJg Bc 6I= sil= uld$el 4lB. "l q EI-u.B (Additive process) €€zl+tlql EdC z|trE !-71= =H, +Asl EE Fql E6Iq dq4ss ^lZt')A Eil qlEJg €C6|= sfl-E HHd+E 4lH. E4 "]]qE]EB (Full additive process) qlqqE-BE aL+s^J +d6ll EA"J9 ^Ig6l= ,IB. *ilE] "lqEltrB (Semi additive process) qlqElE_Bsl aluler.-J +d6H E?g .J +ql SzlE? "t qa E= r ++E ^J-& 6'I= 4lB. 4"1 .EJgB (Die stamping) EiI 'llEJg A++ql ,4.xq €€zl* +Cl d+6I= EAE ts1]dSel 4lB. HEB B (Build-up process) E#, iEflE 5.ql E6Iq zlflle Eil+, €€+g + oI 94zl= +6= EflE tslld +el zrl$. ^l7l€ 4+B (Sequential laminating process) * I EiI uXEJ d++E +al+Bg 4= .JE rEflE EId+E ++,ll E= +E UAE EId+"+ =Et6Iq 4 +6Lr g,q".J 4*, 4rl EFE E#ql ErIq d;I E iI+ eg d+6LE+ + trl+ silE EId+E ,IB. +€ Eilt+B (Plugging process) EE'€. Ee + €..I= +drIE EI+-r., g.Eql Ei]el g.;<l tiEJg €C, qla+ *, ?drll "t E.EE al.zl^ E= 4lA6Iq E +E+Bq EflE Hfld+el 4lB. S zll"l ,ll olC (Pin lamination) Tlol= €ql el6}q + +E Eil tilEJ glzl= aA6Ir 4+ .J^Isl6L= 4+ gAE HlJd+g Ctzl€. s.llEl Lll ol C lamination) El4 "J=qTl EiI yllEJg ,*= .]l+Ell'Jel ^J6L= zJ ?+ y+E4:ae+ EulgE ,A4^l ++"ll= E^lql 4+ 6'I= trl+ sAE tsId+E Ell=t CtI 7)+.