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r32 HJEill Etrlil al Aq "l|tr 1. Pll]|El_= T|"} EoJ 71. g"J Eol. Gl _ 3. o /\{ = 6H e4slE zlS (Printed Circuit Board / Printed Wiring Board) PCB= Printed Circuit Board9 e+"1 ol 4 "J 4lgl E7l+g E++ saE 4s (Printed circuit) uilE H11d+ uflE BE s= BzIB*eE +C9= E]E-. +E silE H]]d+ (Single-sided printed circuit board) EEql"J s.;1 rIEJol g.l= sA= uHd+. *E silE Hl]d+ (Double-sided printed circuit board) "JEql EiI rllEJ"l 9l= sAE_ H}]dS. 4= gilE Hlld+ (Multilayer printed circuit board) 4 *zJ 4i 4ee +4 d+gqrl -EE Eil6g E .J6Iq 36= oltlql Ei]rllEJol gl= sAE HBd+. Szllxlg sAE tsl]d+ (Flexible printed circuit board) fr€C"l il= etszj*9 ^l+6J EA_E HHd+. "ItJ _H-= (Mother board) iiflE+ =B+g ++6la rE d+6J + ilE uHd+. ++E (Component side) q+Eel BE"l BrHq= sAE HIdS$ E. "JBE (Solder side) ++EE Hlrfl+ EA_E HflC+tsola, rfl+E €lulzl ol+q;<l= E. ! zl' (crid) AE EId+ +E d+ +EE glzl= 44617) 9la]l 4-n6l= ,Je ,J4E rJ"Jd =ql E6Iq dzlE 4zl. gil E (Printing) 4+ ,JBql trl$ EE tlql rIEJg ,ll€61- 7lB. 4 H (Pattem; oils El]d+ tlql BC€ EdC E€ ,; ulEdC E€.
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부록 1. 반도체 표면처리 용어해살